Epoxies, Etc. is a leader in thermal management materials. Our chemists and application engineers have developed polymer formulations that provide various cure schedules, viscosities, and fast continuous heat dissipation for a variety of electronic and industrial applications.
Our polymer systems include thermally conductive adhesives, potting compounds, and greases. These products utilize highly conductive fillers and also provide outstanding electrical insulation.
We have developed the below listed thermally conductive systems by formulating with unique combinations of fillers, particle sizes, and dispersion techniques. Flame retardant systems are also available. Not all products are listed, and custom formulations are available upon consultation.
| Short Description | Viscosity, cP | Thermal Conductivity, W/m·K | Operating Temperature Range, ºC | | PDF |
|---|
| 50-1220 | One component thermally conductive silicone grease X 50-1220 is a one component thermal grease. This heavy filled Heat Sink Compound promotes high thermal conductivity, low bleed, and high temperature stability. The 50-1220 is engineered for applications requiring fast heat dissipation and electrical insulation. | Grease Like Paste | 1.15 | -40 to +210 | |  |
| 50-1225 | Flexible silicone that offers high heat resistance X 50-1225 is a low viscosity, room temperature curing silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package. 50-1225 can be used for potting or encapsulating electronic packages that have sensitive components. | 32,000 | 1.73 | -65 to +210 | | |
| 50-1952 | Thermally conductive silicone with easy to use 1:1 mix ratio X 50-1952 is a two component silicone potting and encapsulating compound. This silicone system is designed for quick thermal transfer away from heat generating electronic devices. The 50-1952 has a simple 1:1 mix ratio, can be cured in thick sections, is non-corrosive, and reversion resistant. The black silicone resin and white activator provide an excellent visual indication of a complete mix. | 30,000 | .87 | -65 to +235 | | |
| 50-2366 FR | Urethane offering low stress and flame retardancy X 50-2366FR is a thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system is a good choice for potting applications containing surface mount components or any application requiring low stress, thermal conductivity and flame retardancy. | 9,000 | 1.15 | -65 to +135 | | |
| 50-2369 FR | UL 94 V-0 Listed Urethane X The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-0. 50-2369 FR Urethane is listed with Underwriter’s Laboratory for passing UL94 V-0. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. | 8,500 | 1.15 | -65 to +135 | | |
| 50-3100 | Fast dissipation of heat away from components X 50-3100 is designed for the fastest and most continuous high heat transfer. 50-3100 measures several times faster heat dissipation than other commercially available types. The most important breakthrough is the handling of 50-3100. This system can be easily mixed and poured to form a dimensionally stable heat transfer package. | 180,000 | 2.16 | -60 to +205 | | |
| 50-3112 | Fast epoxy adhesive for use in the TriggerBond system X 50-3112 is a two component fast curing thermally conductive epoxy adhesive. This product was specifically formulated for use in the convenient TriggerBond dual barrel cartridge system. 50-3112 has a simple 1:1 mix ratio and develops a 1,400 psi Lap Shear strength (aluminum to aluminum) in four hours at room temperature. After just twenty four hours the strength is over 2,200 psi. | 70,000 | 1.04 | -40 to +120 | | |
| 50-3122 | One component epoxy adhesive with wide temp. range X 50-3122 is a one component (no mixing is necessary) epoxy adhesive with a unique combination of physical properties. This adhesive provides both high shear and high peel strengths. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205°C. 50-3122 is formulated to offer superior resistance to impact, thermal shock, vibration and stress fatigue cracking. | 165,000 | 1.44 | -60 to +205 | | |
| 50-3150FR | UL 94 V-0 Listed Epoxy X 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 30 are listed with Underwriter’s Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. Typical applications for 50 3150 FR include encapsulating power supplies, transformers, coils, insulators, sensors, etc... This system is an excellent choice for applications requiring high thermal conductivity and flame retardancy. | 30,000 | 2.16 | -60 to +200 | | |
| 50-3151 NC FR | Low viscosity epoxy meets non-burning UL 94 V-0 X 50-3151 NC FR has been formulated to meet the stringent non-burning requirements of UL 94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. 50-3151 NC FR is low in viscosity and therefore offers outstanding flow around components. | 5,000 | 1.30 | -65 to +190 | | |
| 50-3152 FR | UL 94 V-0 listed epoxy X 50-3152 FR is listed with Underwriter's Laboratories for passing UL 94 V-0. It is a two component epoxy potting and encapsulating system. This semi-rigid epoxy has excellent shock and vibration resistance along with good thermal conductivity. 50-3152 FR is designed for ease of use. It has a convenient 1:1 mix ratio and is low in viscosity. | 31,000 | 1.01 | -40 to +135 | | |
| 50-3170 | Flexible epoxy potting and encapsulating system X 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. 50-3170 can be used for bonding sensitive components or for potting of power supplies, coils, glass diodes, and other delicate assemblies. | 15,000 | 1.73 | -70 to +150 | | |
| 50-3182 NC | Highly filled epoxy with excellent physical properties X 50-3182 NC is a highly filled epoxy system with excellent physical, electrical, and thermal properties. 50-3182 NC offers very high thermal conductivity, excellent electrical insulation, and low thermal expansion. This unique combination of properties makes this system ideal for applications where electrical insulation and mechanical protection must be maintained while transferring heat. | 15,000 | 1.66 | -55 to +205 | | |
| 50-3185 NC | Meets NASA outgassing with Cat.190 or Cat. 30 X 50-3185 NC is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 NC is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose from. When cured with Catalyst 190 or Catalyst 30 this system meets NASA’s outgassing requirements. | 16,000 | 1.36 | -55 to +205 | | |
| 50-3186 NC | Thermally conductive epoxy adhesive X 50-3186 NC is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 NC is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance. | Paste | 1.38 | -40 to +230 | | |
| 70-3812 NC | Aluminum filled adhesive for bonding heat sinks X 70-3812 NC is a two component, aluminum filled epoxy system. This system is used
for making heat resistant tools, parts, or bonds that require the highest thermal conductivity and heat resistance.
70-3812 NC passes NASA’s outgassing requirements per ASTM E-595-07.
| 8.000 | 4.5 | -55 to 155 | | |
Having trouble deciding on which of our products best meets your critical heat transfer requirements? Then let us assist you in selecting a product by using our online Product Selection Form. If we do not have an existing product that meets your requirements, we will develop one!