New Fast Curing Thermally Conductive Epoxy Is Easy To Use!

Optical and Semiconductor Grade Epoxy Resin

November 21, 2016

An Optical and Semiconductor Grade Epoxy Resin system has been developed for LED encapsulating, glob top encapsulation, fiber optics and as an underfill for flip chips.  The 20-3401 provides outstanding adhesion to glass, quartz, most plastics, and metals.   It is easy to work with, allows users a long working time, and easily flows at room temperature.   REACH and RoHS compliant, this epoxy resin is a good choice for electronic assemblies.  In addition, 20-3401 is available in the convenient FreezedBond® premixed and frozen syringes.  Samples of the 20-3401 Clear Epoxy are available.