New Fast Curing Thermally Conductive Epoxy Is Easy To Use!

Lightweight, but solid

January 14, 2013

This epoxy syntactic foam system is a low density, two component epoxy potting and encapsulating system which utilizes an advanced micro balloon technology filler. This technology allows the 20-3035 to weigh half of what most commercially available potting compounds do yet still provide high strength and stiffness. The product exhibits a low coefficient of thermal expansion, low shrinkage and is water resistant.

Click here for the 20-3035 technical bulletin.