New Fast Curing Thermally Conductive Epoxy Is Easy To Use!

Easy Mix Epoxy For Electronics

August 19, 2014

June 17, 2014 - Thanks to its one-to-one mix ratio and room temperature cure, our 20-3650 Epoxy Potting and Encapsulating Compound has been formulated for ease-of-use in a variety of electronics assembly applications.

At the same time, this non-hazardous potting compound does not skimp on properties. It features:

  • A low viscosity.  With a viscosity of just 25,000 cps for the resin and 12,000 cps for the catalyst, 20-3650 is ideal for mix and meter dispensing systems. 
  • Robust mechanical properties.  20-3650 has a tensile strength of 11,000 psi and a compressive strength of 15,500 psi. Linear shrinkage is only 0.004 in/in. 
  • Excellent thermal properties.  20-3650 has a thermal conductivity of 0.61 W/m·K.  Its coefficient of thermal expansion is 27X10-6/ºC. And it withstands operating temperatures from -60 to 150 ºC.
  • High dielectric strength.  20-3650 works well as an electrical insulator based on its dielectric strength of 460 V/mil and dielectric constant of 4.3 at 60 Hz.

For a complete list of 20-3650's mechanical and physical properties, download our technical bulletin. Or get a free sample of 20-3650 or any of our other epoxy potting compounds at www.epoxies.com/try-adhesives.aspx.
 

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