Easy Mix Epoxy For Electronics
August 19, 2014
June 17, 2014 - Thanks to its one-to-one mix ratio and room temperature cure, our 20-3650 Epoxy Potting and Encapsulating Compound has been formulated for ease-of-use in a variety of electronics assembly applications.
At the same time, this non-hazardous potting compound does not skimp on properties. It features:
- A low viscosity. With a viscosity of just 25,000 cps for the resin and 12,000 cps for the catalyst, 20-3650 is ideal for mix and meter dispensing systems.
- Robust mechanical properties. 20-3650 has a tensile strength of 11,000 psi and a compressive strength of 15,500 psi. Linear shrinkage is only 0.004 in/in.
- Excellent thermal properties. 20-3650 has a thermal conductivity of 0.61 W/m·K. Its coefficient of thermal expansion is 27X10-6/ºC. And it withstands operating temperatures from -60 to 150 ºC.
- High dielectric strength. 20-3650 works well as an electrical insulator based on its dielectric strength of 460 V/mil and dielectric constant of 4.3 at 60 Hz.
For a complete list of 20-3650's mechanical and physical properties, download our technical bulletin. Or get a free sample of 20-3650 or any of our other epoxy potting compounds at www.epoxies.com/try-adhesives.aspx.