Control The Flow Of Your Potting Compounds
August 19, 2014
July 10, 2014 - Potting compounds that flow easily may fill every nook and cranny of the electronics cavity. Yet these low-viscosity compounds can also leak from holes or other openings in the cavity before they get a chance to cure.
More viscous compounds can have the opposite problem. They may not leak from the cavity, yet they may not fully fill it either.
Many applications suffer from this flow dilemma—in which the potting compound is either too thin or too thick. What these applications really need is a potting compound whose viscosity starts low while the cavity fills and abruptly becomes high to prevent any leakage.
We produce a variety of these flow control potting compounds. They all have two-component urethane chemistries with viscosities as low as 1,000 CPS immediately after mixing. Though they start off thin, these compounds quickly reach a high-viscosity gel state that stops them from flowing out of the cavity.
By adjusting our formulations, we can dial in both the gel time and the starting viscosity. So we can truly control the flow around electrical components such as printed circuitry, connectors or cables.
For a detailed look at the properties of a flow-controlled product, check out the technical bulletin for our 20-2175 Urethane.
To try one of our flow-controlled formulations in your encapsulation, potting or sealing application, request a sample today.