What's New

These are the products we've introduced over the last year. You may want to search for topics by keyword.

• January 2012

  Epoxies, Etc. Creates Video for TriggerBond® Dispensing System

  The TriggerBond Dispensing System is an easy-to-use, hand-held mixing and dispensing system that allows for clean and efficient application of our two-part epoxies, urethanes and silicones for bonding, sealing, or small potting applications. With TriggerBond you can eliminate the chance of improper ratios or mixing errors and ensure your bonds will last.

• December 2011
  
  UL 94 V-0 listed Flame Retardant Compound that withstands cold temperatures

  The 20-2362 FR potting and encapsulating compound has many beneficial qualities. It is listed with Underwriter’s Laboratory for passing the stringent non-burning requirements of UL 94 V-0. The 20-2362 FR also remains soft in very low temperatures, even to -72° C. This compound is ideal for cushioning and protecting sensitive electronic components since it provides vibration resistance and does not stress components. It will not damage components during cure and has excellent resistance to moisture. REACH and RoHS compliance also make this product export compliant.

• November 2011
  
  Lightweight, but solid

  This epoxy syntactic foam system is a low density, two component epoxy potting and encapsulating system which utilizes an advanced micro balloon technology filler. This technology allows the 20-3035 to weigh half of what most commercially available potting compounds do yet still provide high strength and stiffness. The product exhibits a low coefficient of thermal expansion, low shrinkage and is water resistant.

• October 2011
  
  The Green Series of Polyurethane Potting Compound

  This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond® dual barrel cartridge dispensing system.  These elastomeric systems are suitable for a variety of electronic insulating applications. The base Natural Oil Polyol (NOP) used in these systems is obtained directly from a plant source without chemical modifications. Due to the raw materials selected, these products are low in toxicity and considered GREEN potting compounds.

• August 2011
  
  Epoxies, Etc. Creates 50-3150FR UL Listed Product Video

  The 50-3150FR is listed with Underwriters Laboratory (UL). The new video provides information on what makes this Epoxy Potting Compound unique. This system is bromine, halogen, and antimony free. It is also REACH and RoHS compliant.

• July 2011
  
  Epoxies, Etc. Develops Four New Polyurethane Adhesives

  The 10-2055 and 10-2080 Polyurethane Adhesives were developed to produce a general purpose adhesive for bonding a wide variety of plastic and metal substrates. Each system is offered in two different viscosities; a light paste consistency similar to honey and a heavy paste consistency similar to grease. However, both the Iso and Polyol are low in viscosity prior to mixing for easy handling characteristics. The 10-2055 Adhesives produce a hardness of 55 Shore D and 10-2080 Adhesives produce a hardness of 80 Shore D.

• May 2011
  
  Epoxies, Etc. Develops Epoxy that meets NASA outgassing requirements

  Epoxies, Etc… develops a new Epoxy Potting Compound that meetsNASA’s outgassing requirements. 20-3652 is a filled epoxy casting,potting, and encapsulating resin system. This is a dielectric grade epoxy thatexhibits excellent physical, thermal and electrical insulation properties.

• May 2011
  
  Epoxies, Etc. Develops Easy To Use Polyurethane

  20-2125 is formulated for electronic potting, encapsulating and casting applications. The20-2125 is a two-component, low viscosity, room temperature curing system. A unique feature of this product is the ability to modify the hardness by simply changing the mix ratio of the Polyol and Isocyanate. A hardness range of Shore A 17 to 55 is possible with the 20-2125.

• April 2011
  
  Epoxies, Etc. Develops New Elastomeric Polyurethane Potting Compound

  20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2121 will cushion and protect sensitive electronic components. It will impart very little stress on components during cure or thermal cycling.

• March 2011
  
  Epoxies, Etc. Develops Two New Polyurethane Potting Compounds

  50-2185 is a filled 80 Shore A system exhibiting flexibility to -55C, high thermal conductivity, and flame resistance meeting UL 94 V-O.  These unique set of properties provide low component stress upon curing and extreme thermal cycling making 50-2185 ideal for protecting electronic assemblies in the solar and automotive markets.

  20-2135 is an unfilled 35 Shore A, low viscosity system allowing quick penetration around electronic components.  The low durometer and Tg (-55C) provide a lower cost alternative for some silicone and polybutadiene based polyurethane applications.

• February 2011
  
  Epoxies, Etc. develops a new urethane casting resin for producing stable cast parts
  
  70-2170 has an "ABS like feel and appearance." The 70-2170 can be used to simulate final injection-molded parts. This is an inexpensive method to develop parts for pre-production evaluation, market testing, clinical trials, and low volume production.
  
  The 70-2170 Urethane Casting Resin has the following properties:
  • High Impact Resistance
  • Dimensionally Stable
  • Excellent Machinability
  • Fast Room Temperature Cure
  • High Durometer
  • Convenient 2:1 Mix Ratio

• January 2011
  
  Epoxies, Etc… Announces a Revision of its Corporate Brand

  As we continue to diversify and expand our product offerings to meet our customer needs and the needs of an ever-changing environment, we have decided to revise our corporate brand. The new brand, which includes our logo and tag line, better reflects our position as your partner and an industry leader. The new design and tagline reflects a more flexible, customized business approach-something all of us at Epoxies, Etc. take great pride in.

• December 2010
  
  Epoxies, Etc… Builds New R&D Laboratory

  Epoxies, Etc… is pleased to announce the completion of a new R & D and Quality Control Laboratory. Michael Harrington, President and CEO of Epoxies, Etc… stated, “The additional laboratory and testing equipment expands our research capabilities and provides needed space for the quality control department.”
  
  The new equipment in the laboratory increases the company’s testing capabilities as it continues to develop new epoxy, urethane and silicone systems. This expansion allows Epoxies, Etc… to diversify and expand its’ product offerings to meet customer needs and the needs of an ever-changing manufacturing environment.

• October 2010
  
  Easy to use 1:1 Ratio Epoxy Potting Compound

  The 20-3001 NC was engineered to be an easy to use epoxy potting compound.  Many commercially available potting compounds have wide mix ratios that make measuring difficult.  These same materials typically contain fillers which cause settling and a high viscosity.  20-3001 NC solves many of the common processing problems that electronic manufacturers experience with potting compounds.  This product does not contain fillers, has an easy 1:1 by volume ratio, and forms a smooth glass like finish when cured.

• September 2010
  
  Low Viscosity Epoxy Potting & Encapsulating Compound

The 20-3060 Electronic Grade Epoxy Potting Compound was developed for fast self leveling and flow around densely populated printed circuit boards (PCB). This product is unique due to it’s low viscosity, excellent air release properties, and glass like finish when cured. The 20-3060 will provide excellent protection for electronics and it bonds extremely well to substrates typically used in electronic assemblies.

• August 2010
  
  SMT Stencil Bonding Adhesives

  Epoxies, Etc... has developed several structural epoxy adhesives that meet the stringent assembly needs of the SMT Stencil Manufacturing industry. These epoxy adhesives produce tough and long-lasting bonds. They are low shrinkage, provide excellent impact and vibration resistance, and withstand cleaning cycles.

• July 2010
  
  Keeping It Cool with 50-2369

  Appliance Magazine recently published an article on the cooling characteristics of the 50-2369. This two component polyurethane potting compound provides quick heat dissipation, UL 94 V-O certified, and  also RoHS compliant.

• June 2010
  
  Epoxies, Etc...  Announces New IllumaBond™ Brand

  Epoxies, Etc... proudly announces the launch of the new IllumaBond™ brand of UV Curable Adhesives, Potting Compounds, and Coatings. The branding of the UV Curable Products is a further commitment to the exciting new technology of Ultraviolet Chemistry. IllumaBond™ UV Curable Products are being used extensively in the electronic, electrical, medical, and industrial markets. Customers in these markets realize that the fast cure speeds and one component features of the IllumaBond™ products improves productivity and reliability.

• June 2010
  
  Thermally Conductive UL 94 V-O Urethane Potting Compound

  Epoxies etc...'s UL 94 V-O listed 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. It offers a unique combination of properties seldom seen in a Thermally Conductive Potting Compound. 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test.

• May 2010
  
  Water Resistant UV Curable Potting & Encapsulating Compound

  Epoxies, Etc... has developed a UV Curable Potting Compound that is resistant to water and able to cure in thick sections. The UV Cure 60-7114 is a low viscosity urethane adhesive, potting compound and coating. It is a good choice for potting electronic assemblies exposed to excessive moisture.

• April 2010
  
  Flame Retardant and Thermally Conductive Epoxy Potting Compound

  Epoxies, Etc... has developed a Thermally Conductive Epoxy that self extinguishes in seconds. The 50-3150 FR is UL 94-VO listed. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties.

• March 2010
  
  Thermally Conductive Polyurethane Potting Compound

  Epoxies, Etc... has developed a Thermally Conductive Polyurethane Potting Compound. The 50-2366 FR is also flame retardant. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties.

• December 2009
  
  Water Clear Optical Grade Epoxy
  
  

  Epoxies, Etc... has developed a Water Clear Epoxy Potting Compound and Adhesive. 20-3238 is a two component high purity grade polymer epoxy system. This is a low viscosity formulation designed for L.E.D. encapsulating, fiber optic applications and any potting application requiring the optimum clarity for inspection.

• November 2009
  
  Flexible Potting Compound Designed for Low Temperatures
  
  

  Epoxies, Etc... has developed a Flexible Polyurethane Potting Compound that is perfect for low temperature applications. The 20-2353 is engineered to provide low stress on electronic components and to resist moisture. It provides excellent hydrolytic stability, low moisture permeability, a low glass transition temperature (-70C), and low stress on sensitive components.  

• October 2009
  
  Chemical Resistant Epoxies
  
  Epoxies, Etc... has developed two Chemical Resistant epoxies. The 20-3004 LV and 20-3004 HV are formulated for potting, coating, and adhesive applications requiring superior chemical resistance. These products cure at room temperature and have convenient mix ratios.
   
• September 2009
  
  UV Curable Encapsulating Compound
  
  Epoxies, Etc... has developed a filled UV Curable Encapsulating Compound with a low Coefficient of Thermal Expansion (CTE). The 60-7106 is an electronic grade UV Curable Resin system utilizing proprietary fillers that allows ultraviolet light to penetrate the material and cure in deep sections.