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Outlined below are several specialty formulated electronic insulating
compounds. Epoxies, Etc's resins are used to protect, insulate,
and conceal circuitry, components, and devices. These formulations
were designed to satisfy the requirements of many demanding potting,
encapsulating, and casting applications in the electronic, electrical,
automotive, and aerospace industries.
Key
Benefits
- Variety
of durometers and cure schedules to choose from
- Orders
shipped in 3-5 days
- Custom
formulations available
The
products listed below are only a representation of the many products
Epoxies, Etc... manufactures.
Go
to Conversions, Measures, and Weights
| POTTING,
ENCAPSULATING & CASTING RESINS |
| PRODUCT |
DESCRIPTION |
MIXED
VISCOSITY
CPS, @ 25°C |
SPECIFIC
GRAVITY
@ 25°C |
SHORE
HARDNESS |
OPERATING
TEMP. °C |
| 10-3026 * |
Clear,
fast setting epoxy resin system. 10-3026 provides
good dielectric strength, and is therefore a
good choice for small electronic
potting and encapsulating applications. Typical
set time is within ten
minutes. |
11,000 |
1.17 |
85A |
-40
to +120 |
| 20-2028 |
Rigid
closed cell urethane foam. 11 Lbs. per cubic foot density.
Fast 10 minute cure schedule. |
250 |
1.23 |
Foam |
-50
to +150 |
| 20-2100 |
Flexible
urethane system. Low viscosity and ideal for potting delicate
components. Exhibits very low shrinkage, stress, and exotherm
during cure. |
1,600 |
1.50 |
45A |
-55
to +130 |
| 20-2100FR |
Flame
retardant flexible urethane system. Meets the stringent
requirements of UL 94-VO |
8,000 |
1.4 |
80A |
-55
to +130 |
20-2305
20-2350
20-2360
|
Two
component urethane series that provides outstanding thermal
cycling properties, low glass transition temperatures
and low embedment stress to sensitive electronic components. |
4,200
1,600
1,600 |
.91
.90
.90 |
25A
50A
90A |
-40
to +125 |
| 20-2353 |
20-2353
is a low durometer potting, casting, and encapsulating
compound. This two
part system is engineered to provide low stress on
electronic components and to resist moisture. |
3,500 |
.90 |
40A |
-40
to +125 |
| 20-2355
* |
This unique formulation is unfilled and repairable. Its
low viscosity, low durometer, and room temperature cure
make it an ideal candidate for the potting of sensitive
and delicate electronic components. |
1,800
|
.91 |
25A |
-40
to +150 |
| 20-2365 |
Low
viscosity polyurethane designed for low stress on sensitive
components during and after cure. This filled polyurethane
resin system is formulated for applications requiring
low exotherms, low shrinkage, and excellent electrical
properties. |
3,000 |
1.3 |
65D |
-65
to +135 |
| 20-2366FR |
Thermally
conductive polyurethane potting compound. This flexible
system is designed for low stress on sensitive components
during and after cure. 20-2366 FR polyurethane resin system
is formulated for applications requiring low exotherm,
low shrinkage, and excellent electrical properties. |
9,000 |
1.5 |
65D |
-65
to +135 |
| 20-2620 * |
Polyurethane compound designed for applications requiring
"water like" clarity. This room temperature curing system provides
excellent environmental protection and will not yellow. |
2,700 |
1.1 |
85A |
-40 to +135 |
| 20-3001
NC
* |
Low
viscosity, fast curing, easy 1:1 ratio epoxy. This unfilled
system forms a glass like finish when cured. |
1,000 |
1.12 |
55-60D |
-50
to +150 |
| 20-3003
* |
low
viscosity, potting, encapsulating, and adhesive system.
Its low viscosity allows for good flow and wetting of
substrates. |
24,500 |
1.02 |
84D |
-40
to +135 |
20-3004
LV
*
20-3004 HV
* |
20-3004
LV & HV are two component chemical resistance epoxy
systems. They were developed for potting, coating, and
adhesive applications requiring superior chemical resistance.
They exhibit outstanding bonds to a variety of substrates. |
7,000
Gel |
1.17
1.06 |
78D
78D |
-50
to +140
-50 to +150 |
| 20-3006
* |
Unique
two component, electronic grade, flexible epoxy potting
compound engineered to provide electrical insulation,
chemical protection, and thermal shock resistance. |
19,000 |
1.45 |
75A/30D |
-50
to +140 |
| 20-3035 |
Low
density epoxy syntactic system. Has very low shrinkage
and low CTE. Excellent for fabricating light weight parts. |
1,800 |
.90 |
80D |
-40
to +130 |
| 20-3060 |
Popular
low viscosity potting compound. Filled with non abrasive
fillers and therefore ideal for meter mix dispensing.
Forms bubble free glass like finish.
|
10,000 |
1.50 |
82D |
-50
to +135 |
| 20-3060
FR |
Flame
retardant version of the 20-3060. It meets the stringent
flame out requirements of UL 94-VO. |
10,000 |
1.52 |
82D |
-50
to +135 |
| 20-3062 |
Meets
the FDA regulations permitting use in food contact applications. |
30,000
or
15,000 |
1.06 |
84D |
-55
to +135 |
| 20-3064 |
Flexible
epoxy. Ideal for the thermal cycling and potting of delicate
components. Available in a low viscosity and flame retardant
version. |
40,000 |
1.40 |
60A |
-70
to +100 |
| 20-3236 |
low viscosity copolymer adhesive and potting compound
specifically designed for bonding vinyls and neoprenes.
Has an extended working time, is 100% solids, and has
a convenient 2:1 mix ratio. |
3,000 |
1.07 |
80D |
-55
to +120 |
| 20-3238 |
Water
clear optical grade epoxy. High purity polymer system
designed for L.E.D. encapsulating and fiber optic applications.
Low viscosity with excellent air release. |
500 |
1.11 |
78D |
-50
to +150 |
| 20-3300 |
Low
shrinkage, high tensile and compressive strength. Ideal
for high heat and thermal shock exposure. Has excellent
adhesion to most substrates and forms a hermetic like
seal to protect encapsulated parts. Convenient 1:1 mix
ratio. |
12,000 |
1.65 |
87D |
-70
to +260 |
20-3302
*
20-3302
LV
* |
Two
component, ultra clear epoxy system. It provides
excellent optical transmission along with outstanding
adhesion and electrical properties. |
500
250 |
1.1
1.1 |
85D
85D |
-45
to +135
-45 to +135 |
| 20-3650 |
Easy
to use, one to one ratio, electronic grade epoxy system.
Exhibits excellent physical, thermal, and electrical insulation
properties and is D.O.T. non-hazardous, easy to mix, and
will cure at room temperature or with mild heat. |
25,000 |
1.5 |
75D |
-60
to +150 |
| 20-3651 |
Offers
maximum in electrical insulation. 20-3651 is easily machined
and exhibits outstanding adhesion to metals, ceramics,
and plastics. Meets NASA's outgassing requirements. Available
in a flame retardant version; 20-3651FR. |
220,000 |
1.65 |
88D |
-65
to +160 |
| 20-3651\40 |
Lower
viscosity version of 20-3651. Available in a flame retardant
version; 20-3651\40FR. |
4,000 |
1.45 |
88D |
-40
to +155 |
|
* available in convenient TriggerBond®
Packaging
IMPORTANT:
The information in this table is based on data obtained by our
own research and is considered accurate. However, no warranty is
expressed or implied regarding the accuracy of these data, the results
to be obtained from the use thereof, or that any such use will not
infringe any patent. This information is furnished upon the condition
that the person receiving it shall make his own tests to determine
the suitability thereof for his particular purpose.
Selecting
the correct curing agent for a two component epoxy system is just
as important as selecting the correct resin. So don't forget to
check out our curing agents.
Having
trouble deciding on which of our products best meets your critical
potting and encapsulating requirements? Then let us assist you in
selecting a product by using our online Product
Selection Form. If we do not have an existing product that meets
your requirements, we will develop one!
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