News

Review the latest product developments and company news by Epoxies, Etc. 

Too many potting and encapsulating compounds are difficult to work with due to their odd mix ratios, high viscosity, and long cure times.  In addition, some of these older generation materials...
Today's electronic assemblies have to perform in some of the harshest environments. Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 25 years. Several...
Rigid polyurethane foams are specified by engineers and design professionals for their unique set of physical properties.  For instance, the 20-2028 Polyurethane Foam was developed to offer reduced...
Technical Sales Representative Epoxies, Etc ., an ISO 9001:2008 registered company was founded in 1987 as a formulator of specialty epoxy, urethane, and silicone systems. As an industry leader, our...
Epoxy adhesives, sealants and potting compounds must meet certain requirements in order to be considered for use within or as a part of a medical device. In addition to important cured properties...
An Optical and Semiconductor Grade Epoxy Resin system has been developed for LED encapsulating, glob top encapsulation, fiber optics and as an underfill for flip chips.  The 20-3401 provides...
Epoxies, Etc. has developed a fast curing thin film Electrically Conductive Adhesive.  Room temperature curing Electrically Conductive Adhesives are ideal for bonding and sealing applications that...
Adding less weight to electronic assemblies is an important consideration for design engineers.  This is especially true for automotive, aerospace and consumer electronic applications. Our chemists...
Four of Epoxies, Etc.’s UL Listed Potting and Encapsulating Compounds are high-lighted on epoxies.com  All  four of the products pass the stringent self-extinguishing UL 94 V-0 test and are listed...
Mixing and proportioning of two component epoxy systems is time consuming and prone to processing errors.  The 20-3213 is a one component heat cure system designed for electronic applications...
Electronic assemblies and delicate components increasingly need soft encapsulating materials to provide protection.  A unique series of Clear Silicone Gels (20-1700 Series) were developed to seal and...
High performance two component Potting and Encapsulating materials are known for their slow room temperature cure times. This becomes a frustrating productivity issue for many manufacturers. ...
A video has been created explaining the quality process behind the creation of the FreezeBond® premixed and frozen syringes.  A premixed and frozen epoxy adhesive eliminates waste, reduces worker...
FreezeBond is offered by Epoxies, Etc. to eliminate the downside of working with two component adhesives and potting compounds.  This packaging option is being incorporated into many adhesive and...
Cranston, RI – January 28, 2015 – Epoxies Etc. has added three new fast-cure epoxies to the range of adhesive products suitable for use with TriggerBond® dispensing guns. The TriggerBond system...
The 20-2330 Series of low durometer urethanes, ranging from Shore A 30 to Shore A 90, is perfect for protecting electronic and other components in extreme conditions.  This Series has outstanding...
60-7158, a UV Curable Epoxy Adhesive, is specially formulated for excellent adhesion to rigid substrates.  Its high thixotropic index ensures the material stays in place, making it a great choice for...
You'll Wish Every Thermally Conductive Compound Was This Easy To Use... But you won't have to... because 50-3152FR has everything you look for in a Thermally Conductive Potting Compound.  See for...
50-3152FR Thermally Conductive Compound Self-Extinguishes and Mixes in Equal PartsEpoxies, Etc. continues to formulate new products to meet industry need, this time creating a unique thermally...
Electronics can produce a lot of heat. Epoxies, Etc. offers a solution with several thermally conductive potting compounds that protect your electronic components from the damages of overheating, ...
10-3062, by Epoxies, Etc., is a two component epoxy compound that is easy to use and a good solution for applications where proper handling of wet or dry food materials is important.  10-3062 meets...
20-1650, by Epoxies, Etc., is a two component silicone elastomer designed specifically for applications where a large amount of heat is emitted such as in oil drilling or high voltage assemblies. ...
With a volume resistivity of .005, 40-3909 provides a reliable electrical connection at about half the price of silver filled epoxies.  Because of its ability to cure at room temperature and easy 1:1...
“Electronics Protection" magazine asked Epoxies, Etc. to share some expertise recently for a featured article in their May/June 2013 issue.  The purpose of the article was to help engineers select...
50-1952, by Epoxies, Etc., is a Thermally Conductive Silicone Potting and Encapsulating Compound with outstanding properties over a broad temperature range.  Many electrical potting applications...
Electrically conductive adhesives can be used as an electrical interconnect on non-solderable substrates such as plastic or ceramics, or to replace solder on thermally sensitive components that...
When potting electronics, customers seek products that are safe and easy to use and will perform under harsh operating conditions. The 20-1700 Series Silicones are a family of soft electronic...
Light-Emitting Diodes (LED) are quickly replacing incandescent bulbs and compact fluorescent bulbs.  There are many advantages to using LED lighting devices.  Not only can they last up to 50,000...
Epoxies, Etc. introduces the 20-2180, a Polyurethane Potting and Encapsulating Resin that has fitting properties for cable and harness assemblies. The 20-2180 can be poured into a metal or silicone...
The 60-7170 solves many problems potting and encapsulating applications face. The 60-7170 is a one component material, has the ability to "shadow" cure, and cures in sections as deep as 3/4...
The 50-3150FR is listed with Underwriters Laboratory (UL). The new video provides information on what makes this Epoxy Potting Compound unique. This system is bromine, halogen, and antimony free. It...
Appliance Magazine recently published an article on the cooling characteristics of the 50-2369. This two component polyurethane potting compound provides quick heat dissipation, UL 94 V-O certified, ...
The 10-2055 and 10-2080 Polyurethane Adhesives were developed to produce a general purpose adhesive for bonding a wide variety of plastic and metal substrates. Each system is offered in two different...
This epoxy syntactic foam system is a low density, two component epoxy potting and encapsulating system which utilizes an advanced micro balloon technology filler. This technology allows the 20-3035...
The 20-2362 FR potting and encapsulating compound has many beneficial qualities. It is listed with Underwriter’s Laboratory for passing the stringent non-burning requirements of UL 94 V-0. The...
This two component urethane series are low durometer (30-90 Shore A), potting, casting, and encapsulating compounds. They are unfilled materials engineered to provide excellent hydrolytic stability...
The 10-3713 is a two component epoxy adhesive that dries so clear, excess material is barely noticeable. It resists yellowing due to addition of special proprietary ultraviolet protectors. The...
This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond®...
The TriggerBond® Dispensing System is an easy-to-use, hand-held mixing and dispensing system that allows for clean and efficient application of our two-part epoxies, urethanes and silicones for...